Design and development of interconnects for ultra-fine pitch wafer level packages

Design and development of interconnects for ultra-fine pitch wafer level packages

10.1109/ICEPT.2005.1564732

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書目詳細資料
Main Authors:	Tay, A.A.O., Iyer, M.K., Tummala, R.R.
其他作者:	MECHANICAL ENGINEERING
格式:	Conference or Workshop Item
出版:	2014
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/73317
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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