Design and development of interconnects for ultra-fine pitch wafer level packages

由 Tay, A.A.O., Iyer, M.K., Tummala, R.R.
出版 2014

Novel circuit model for three-dimensional geometries with multilayer dielectrics

由 Jayabalan, J., Ooi, B.-L., Leong, M.-S., Iyer, M.K.
出版 2014

Modelling and application of elastomer mesh for microwave probing

由 Jayabalan, J., Ooi, B.-L., Leong, M.S., Iyer, M.K.
出版 2014

Circuit model of elastomer probe for fine pitch wafer level package test applications

由 Jayabalan, J., Ooi, B.L., Leong, M.S., Iyer, M.K.
出版 2014

A scaling technique for partial element equivalent circuit analysis using SPICE

由 Jayabalan, J., Leong, O.B., Seng, L.M., Iyer, M.K.
出版 2014

PEEC model for multiconductor systems including dielectric mesh

由 Jayabalan, J., Ooi, B.L., Irene, A., Leong, M.S., Iyer, M.K.
出版 2014

Novel electrical performance analysis for leaded packages

由 Jin, Z., Ma, J., Iyer, M.K., Ooi, B.L., Leong, M.S.
出版 2014

A methodology for accurate modeling of a pad structure from S-parameter measurements

由 Jayabalan, J., Ooi, B.L., Wu, B., Xu, D.S., Iyer, M.K., Leong, M.S.
出版 2014

New fabrication technology for photonic crystal waveguides

由 Mehta, S.S., Murthy, B.R., Hui, Z., Suryani, Ji, W., Iyer, M.K., My, D.
出版 2014

Test bench modeling and characterization for fine pitch wafer level packaged devices

由 Jayabalan, J., Mihai, R.D., Tan, J.P.H., Iyer, M.K., Leong, O.B., Seng, L.M.
出版 2014

A novel test strategy for fine pitch wafer-level packaged devices

由 Jayabalan, J., Rotaru, M.D., Rao, V.S., Kripesh, V., Iyer, M.K., Tay, A.A.O., Ooi, B.-L., Leong, M.-S.
出版 2014

A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging

由 Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Iyer, M.K.
出版 2014

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

由 Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
出版 2014

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

由 Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
出版 2014