Design and development of interconnects for ultra-fine pitch wafer level packages

• Main Authors: Tay, A.A.O., Iyer, M.K., Tummala, R.R.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Conference or Workshop Item
• 出版: 2014
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/73317
• 機構: National University of Singapore

10.1109/ICEPT.2005.1564732