Design and development of interconnects for ultra-fine pitch wafer level packages

بواسطة Tay, A.A.O., Iyer, M.K., Tummala, R.R.
منشور في 2014

Synthesis and characterization of palladium nanoparticles-corannulene nanocomposite: an anode electrocatalyst for direct oxidation of methanol in alkaline medium

بواسطة Bhavani, Kalli Sai, Anusha, Tummala, Stuparu, Mihaiela Corina, Brahman, Pradeep Kumar
منشور في 2022

Synthesis and characterization of corannulene-metal-organic framework support material for palladium catalyst: an excellent anode material for accelerated methanol oxidation

بواسطة Khuntia, Harisankar, Bhavani, Kalli Sai, Anusha, Tummala, Trinadh, Thota, Stuparu, Mihaiela Corina, Brahman, Pradeep Kumar
منشور في 2022

Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

بواسطة Aggarwal, A.O., Raj, P.M., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
منشور في 2014

New paradigm in IC-package interconnections by reworkable nano-interconnects

بواسطة Aggarwal, A.O., Raj, P.M., Abothu, I.R., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
منشور في 2014

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

بواسطة Aggarwal, A.O., Raj, P.M., Abothu, I.R., Ravi, D., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
منشور في 2014

Super stretched solder interconnects for wafer level packaging

بواسطة Rajoo, R., Wong, E.H., Lim, S.S., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
منشور في 2014

Development of stretch solder interconnections for wafer level packaging

بواسطة Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
منشور في 2014

Single or dual antiplatelet therapy after PCI

بواسطة Miyazaki Y., Suwannasom P., Sotomi Y., Abdelghani M., Tummala K., Katagiri Y., Asano T., Tenekecioglu E., Zeng Y., Cavalcante R., Collet C., Onuma Y., Serruys P.
منشور في 2017

Single or dual antiplatelet therapy after PCI

بواسطة Yosuke Miyazaki, Pannipa Suwannasom, Yohei Sotomi, Mohammad Abdelghani, Karthik Tummala, Yuki Katagiri, Taku Asano, Erhan Tenekecioglu, Yaping Zeng, Rafael Cavalcante, Carlos Collet, Yoshinobu Onuma, Patrick W. Serruys
منشور في 2018

Single or dual antiplatelet therapy after PCI

بواسطة Yosuke Miyazaki, Pannipa Suwannasom, Yohei Sotomi, Mohammad Abdelghani, Karthik Tummala, Yuki Katagiri, Taku Asano, Erhan Tenekecioglu, Yaping Zeng, Rafael Cavalcante, Carlos Collet, Yoshinobu Onuma, Patrick W. Serruys
منشور في 2018

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

بواسطة Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
منشور في 2014

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

بواسطة Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
منشور في 2014

Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

بواسطة Kim, W., Madhavan, R., Mao, J., Choi, J., Choi, S., Ravi, D., Sundaram, V., Sankararaman, S., Gupta, P., Zhang, Z., Lo, G., Swaminathan, M., Tummala, R., Sitaraman, S., Wong, C.P., Iyer, M., Rotaru, M., Tay, A.
منشور في 2014

Assessment of recent process analytical technology (PAT) trends: A multiauthor review

بواسطة Simon L.L, Pataki H, Marosi G, Meemken F, Hungerbuhler K, Baiker A, Tummala S, Glennon B, Kuentz M, Steele G, Kramer H.J.M, Rydzak J.W, Chen Z, Morris J, Kjell F, Singh R, Gani R, Gernaey K.V, Louhi-Kultanen M, Oreilly J, Sandler N, Antikainen O, Yliruusi J, Frohberg P, Ulrich J, Braatz R.D, Leyssens T, Von Stosch M, Oliveira R, Tan R.B.H, Wu H, Khan M, Ogrady D, Pandey A, Westra R, Delle-Case E, Pape D, Angelosante D, Maret Y, Steiger O, Lenner M, Abbou-Oucherif K, Nagy Z.K, Litster J.D, Kamaraju V.K, Chiu M.-S
منشور في 2016