Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

• Main Authors: Kim, W., Madhavan, R., Mao, J., Choi, J., Choi, S., Ravi, D., Sundaram, V., Sankararaman, S., Gupta, P., Zhang, Z., Lo, G., Swaminathan, M., Tummala, R., Sitaraman, S., Wong, C.P., Iyer, M., Rotaru, M., Tay, A.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Conference or Workshop Item
• 出版: 2014
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/73407
• 機構: National University of Singapore

Proceedings - Electronic Components and Technology Conference