Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

由 Aggarwal, A.O., Raj, P.M., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
出版 2014

New paradigm in IC-package interconnections by reworkable nano-interconnects

由 Aggarwal, A.O., Raj, P.M., Abothu, I.R., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
出版 2014

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

由 Aggarwal, A.O., Raj, P.M., Abothu, I.R., Ravi, D., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
出版 2014