Design and development of interconnects for ultra-fine pitch wafer level packages

由 Tay, A.A.O., Iyer, M.K., Tummala, R.R.
出版 2014

Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

由 Aggarwal, A.O., Raj, P.M., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
出版 2014

New paradigm in IC-package interconnections by reworkable nano-interconnects

由 Aggarwal, A.O., Raj, P.M., Abothu, I.R., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
出版 2014

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

由 Aggarwal, A.O., Raj, P.M., Abothu, I.R., Ravi, D., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
出版 2014

Super stretched solder interconnects for wafer level packaging

由 Rajoo, R., Wong, E.H., Lim, S.S., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
出版 2014

Development of stretch solder interconnections for wafer level packaging

由 Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
出版 2014

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

由 Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
出版 2014

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

由 Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
出版 2014

Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

由 Kim, W., Madhavan, R., Mao, J., Choi, J., Choi, S., Ravi, D., Sundaram, V., Sankararaman, S., Gupta, P., Zhang, Z., Lo, G., Swaminathan, M., Tummala, R., Sitaraman, S., Wong, C.P., Iyer, M., Rotaru, M., Tay, A.
出版 2014