Design and development of interconnects for ultra-fine pitch wafer level packages

بواسطة Tay, A.A.O., Iyer, M.K., Tummala, R.R.
منشور في 2014

Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

بواسطة Aggarwal, A.O., Raj, P.M., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
منشور في 2014

New paradigm in IC-package interconnections by reworkable nano-interconnects

بواسطة Aggarwal, A.O., Raj, P.M., Abothu, I.R., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
منشور في 2014

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

بواسطة Aggarwal, A.O., Raj, P.M., Abothu, I.R., Ravi, D., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
منشور في 2014

Super stretched solder interconnects for wafer level packaging

بواسطة Rajoo, R., Wong, E.H., Lim, S.S., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
منشور في 2014

Development of stretch solder interconnections for wafer level packaging

بواسطة Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
منشور في 2014

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

بواسطة Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
منشور في 2014

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

بواسطة Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
منشور في 2014

Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

بواسطة Kim, W., Madhavan, R., Mao, J., Choi, J., Choi, S., Ravi, D., Sundaram, V., Sankararaman, S., Gupta, P., Zhang, Z., Lo, G., Swaminathan, M., Tummala, R., Sitaraman, S., Wong, C.P., Iyer, M., Rotaru, M., Tay, A.
منشور في 2014