Vertically Coupled Microring Laser Devices based on InP using BCB Wafer Bonding
In this paper, we present our approach on the realization of vertical coupling technology that has been verified for microlaser fabrication as well as for the realization of high Q resonators with 'loss-less' cavities based on InP. The concept is based on full wafer technology and provides...
Saved in:
Main Authors: | , , , , , , , , , , , , |
---|---|
格式: | text |
語言: | English |
出版: |
Institutional Knowledge at Singapore Management University
2007
|
主題: | |
在線閱讀: | https://ink.library.smu.edu.sg/lkcsb_research/3358 https://ink.library.smu.edu.sg/context/lkcsb_research/article/4357/viewcontent/Waferbonded_ActivePassive_Vertically_Coupled_Micro.pdf |
標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
機構: | Singapore Management University |
語言: | English |
成為第一個發表評論!