Vertically Coupled Microring Laser Devices based on InP using BCB Wafer Bonding

In this paper, we present our approach on the realization of vertical coupling technology that has been verified for microlaser fabrication as well as for the realization of high Q resonators with 'loss-less' cavities based on InP. The concept is based on full wafer technology and provides...

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محفوظ في:
التفاصيل البيبلوغرافية
المؤلفون الرئيسيون: Hamacher, M., Heidrich, H., Troppenz, U., Syvridis, D., Alexandropoulos, D., Mikroulis, S., Kapsalis, A., TEE, Chyng Wen, Williams, K. A., Dragoi, V., Alexe, M., Cristea, D., Kusko, M.
التنسيق: text
اللغة:English
منشور في: Institutional Knowledge at Singapore Management University 2007
الموضوعات:
الوصول للمادة أونلاين:https://ink.library.smu.edu.sg/lkcsb_research/3358
https://ink.library.smu.edu.sg/context/lkcsb_research/article/4357/viewcontent/Waferbonded_ActivePassive_Vertically_Coupled_Micro.pdf
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المؤسسة: Singapore Management University
اللغة: English