Numerical Analysis of Microring Resonator obtained by Wafer-Bonding Technology

由 Kusko, M, Alexandropoulos, D, TEE, Chyng Wen, Kapsalis, A, Cristea, D, Syvridis, D
出版 2005

Vertically Coupled Microring Laser Devices based on InP using BCB Wafer Bonding

由 Hamacher, M., Heidrich, H., Troppenz, U., Syvridis, D., Alexandropoulos, D., Mikroulis, S., Kapsalis, A., TEE, Chyng Wen, Williams, K. A., Dragoi, V., Alexe, M., Cristea, D., Kusko, M.
出版 2007

Wafer-Bonded Active/Passive Vertically Coupled Microring Lasers

由 Hamacher, M., Heidrich, H., Troppenz, U., Syvridis, D., Alexandropoulos, D., Mikroulis, S., Kapsalis, A., TEE, Chyng Wen, Williams, K. A., Dragoi, V., Alexe, M., Cristea, D., Kusko, M.
出版 2008