Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications
10.1109/EPTC.2006.342692
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| Main Authors: | , , , |
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| 格式: | Conference or Workshop Item |
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2014
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| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/73558 |
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