APA引文

Sekhar, V., Balakumar, S., Chai, T., Tay, A., & ENGINEERING, M. (2014). Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications.

Chicago Style Citation

Sekhar, V.N., S. Balakumar, T.C Chai, A.A.O Tay, and MECHANICAL ENGINEERING. Investigation of Mechanical Properties of Black Diamond™ (low-K) Thin Films for Cu/low-k Interconnect Applications. 2014.

MLA引文

Sekhar, V.N., et al. Investigation of Mechanical Properties of Black Diamond™ (low-K) Thin Films for Cu/low-k Interconnect Applications. 2014.