Design and characterization of interposers for high speed fine pitch wafer level packaged device testing

Design and characterization of interposers for high speed fine pitch wafer level packaged device testing

Master's

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書目詳細資料
主要作者:	TAN PANG HOAW, JIMMY
其他作者:	ELECTRICAL & COMPUTER ENGINEERING
格式:	Theses and Dissertations
語言:	English
出版:	2011
主題:	Interposer, Fine-Pitch, High-Speed, Vertical-Compliance, Wafer-Level-Test, Characterization
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/18902
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore
語言:	English

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