Design and development of interconnects for ultra-fine pitch wafer level packages

by Tay, A.A.O., Iyer, M.K., Tummala, R.R.
Published 2014

Novel circuit model for three-dimensional geometries with multilayer dielectrics

by Jayabalan, J., Ooi, B.-L., Leong, M.-S., Iyer, M.K.
Published 2014

Modelling and application of elastomer mesh for microwave probing

by Jayabalan, J., Ooi, B.-L., Leong, M.S., Iyer, M.K.
Published 2014

Circuit model of elastomer probe for fine pitch wafer level package test applications

by Jayabalan, J., Ooi, B.L., Leong, M.S., Iyer, M.K.
Published 2014

A scaling technique for partial element equivalent circuit analysis using SPICE

by Jayabalan, J., Leong, O.B., Seng, L.M., Iyer, M.K.
Published 2014

PEEC model for multiconductor systems including dielectric mesh

by Jayabalan, J., Ooi, B.L., Irene, A., Leong, M.S., Iyer, M.K.
Published 2014

Novel electrical performance analysis for leaded packages

by Jin, Z., Ma, J., Iyer, M.K., Ooi, B.L., Leong, M.S.
Published 2014

A methodology for accurate modeling of a pad structure from S-parameter measurements

by Jayabalan, J., Ooi, B.L., Wu, B., Xu, D.S., Iyer, M.K., Leong, M.S.
Published 2014

New fabrication technology for photonic crystal waveguides

by Mehta, S.S., Murthy, B.R., Hui, Z., Suryani, Ji, W., Iyer, M.K., My, D.
Published 2014

Test bench modeling and characterization for fine pitch wafer level packaged devices

by Jayabalan, J., Mihai, R.D., Tan, J.P.H., Iyer, M.K., Leong, O.B., Seng, L.M.
Published 2014

A novel test strategy for fine pitch wafer-level packaged devices

by Jayabalan, J., Rotaru, M.D., Rao, V.S., Kripesh, V., Iyer, M.K., Tay, A.A.O., Ooi, B.-L., Leong, M.-S.
Published 2014

A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging

by Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Iyer, M.K.
Published 2014

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

by Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
Published 2014

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

by Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
Published 2014