Board level drop test reliability of IC packages

• Main Authors: Chai, T.C., Quek, S., Hnin, W.Y., Wong, E.H., Chia, J., Wang, Y.Y., Tan, Y.M., Lim, C.T.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Conference or Workshop Item
• 出版: 2014
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/73233

Proceedings - Electronic Components and Technology Conference