Fractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couples

Fractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couples

10.1016/j.matlet.2005.10.090

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書目詳細資料
Main Authors:	Jayaganthan, R., Mohankumar, K., Sekhar, V.N., Tay, A.A.O., Kripesh, V.
其他作者:	MECHANICAL ENGINEERING
格式:	Article
出版:	2014
主題:	Fractal dimension Intermetallic compounds Pb-Free solders
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/60362
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

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