Fractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couples

• Main Authors: Jayaganthan, R., Mohankumar, K., Sekhar, V.N., Tay, A.A.O., Kripesh, V.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Article
• 出版: 2014
• 主題: Fractal dimension; Intermetallic compounds; Pb-Free solders
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/60362
• 機構: National University of Singapore

10.1016/j.matlet.2005.10.090