Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance

Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance

10.1109/SENSORS47125.2020.9278879

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書目詳細資料
Main Authors:	JIEMING PAN, Li Yida, LUO YUXUAN, ZHANG XIANGYU, Zaifeng Yang, Wong Liang Tai,David, Niu Xuhua, Tham Chen Khong, THEAN VOON YEW, AARON
其他作者:	COLLEGE OF DESIGN AND ENGINEERING
格式:	Conference or Workshop Item
出版:	IEEE sensors 2022
在線閱讀:	https://scholarbank.nus.edu.sg/handle/10635/218156
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

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