Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

Self-assembled monolayer (SAM) of alkane-thiol is formed on copper (Cu) thin layer coated on silicon (Si) wafer with the aim to protect the surface against excessive oxidation during storage in the room ambient. After 3 days of storage, the temporary SAM layer is desorbed with in situ anneal in iner...

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書目詳細資料
Main Authors:	Ang, X. F., Wei, J., Leong, K. C., Tan, Chuan Seng, Lim, Dau Fatt
其他作者:	A*STAR SIMTech
格式:	Article
語言:	English
出版:	2013
主題:	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
在線閱讀:	https://hdl.handle.net/10356/96042 http://hdl.handle.net/10220/11241
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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