Development of wafer bonding technology for micro-electro-mechanical systems application

• المؤلف الرئيسي: Wang, Lei.
• مؤلفون آخرون: Li, Guoyuan
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/5126
• المؤسسة: Nanyang Technological University

Anodic wafer bonding technology is an important process for fabrication and packaging of Micro-Electro-Mechanical Systems (MEMS). This study concentrates on the anodic bonding process at lower t emperatures, which is more desirable for MEMS fabrication. A model of the electrostatic force was develop...