A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads
The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm...
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| Main Authors: | , , , , , |
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| 其他作者: | |
| 格式: | Article |
| 語言: | English |
| 出版: |
2012
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/95669 http://hdl.handle.net/10220/8243 |
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| 機構: | Nanyang Technological University |
| 語言: | English |