Novel high temperature polymeric encapsulation material for extreme environment electronics packaging

• المؤلفون الرئيسيون: Phua, Eric Jian Rong, Liu, Ming, Cho, Bokun, Liu, Qing, Amini, Shahrouz, Hu, Xiao, Gan, Chee Lip
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2019
• الموضوعات: High Pressure; High Temperature; Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/90058; http://hdl.handle.net/10220/49430
• المؤسسة: Nanyang Technological University

This study explores the usage of resorcinol based phthalonitrile (rPN) in harsh environment electronics encapsulation applications. rPN itself exhibits excellent properties as a high temperature polymeric molding compound in terms of mechanical properties and thermal stability. Its properties improv...