APA引文

Phua, E. J. R., Liu, M., Cho, B., Liu, Q., Amini, S., Hu, X., . . . Engineering, S. o. M. S. &. (2019). Novel high temperature polymeric encapsulation material for extreme environment electronics packaging.

Chicago Style Citation

Phua, Eric Jian Rong, Ming Liu, Bokun Cho, Qing Liu, Shahrouz Amini, Xiao Hu, Chee Lip Gan, and School of Materials Science & Engineering. Novel High Temperature Polymeric Encapsulation Material for Extreme Environment Electronics Packaging. 2019.

MLA引文

Phua, Eric Jian Rong, et al. Novel High Temperature Polymeric Encapsulation Material for Extreme Environment Electronics Packaging. 2019.