Effect of surface treatments on Cu/Ultra-low k interconnection technology

• 主要作者: Tan, Hwa Jin.
• 其他作者: Lau, Wai Shing
• 格式: Theses and Dissertations
• 出版: 2008
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• 在線閱讀: http://hdl.handle.net/10356/3363
• 機構: Nanyang Technological University

Single damascene copper interconnect structures were fabricated. Cu/ultra-low-k (porous SiLKTM) interconnects were subjected to surface treatments to study the effects on the structural and electrical properties, including Fourier transform infrared spectroscopy, atomic force microscopy and electr...