Flexible and printable composite ink for thermalmanagement of soft electronics

• المؤلفون الرئيسيون: Bark, Hyunwoo, Lee, Pooi See
• مؤلفون آخرون: School of Materials Science and Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2023
• الموضوعات: Engineering::Materials::Composite materials; Flexible Heat Sink; Galvanic Replacement
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/170875

Since heat generation in electronic devices causes thermal failure, heat dissipation is of critical importance. Furthermore, deformable devices are subjected to mechanical stress, therefore, mechanically stable thermal management material should be considered. Herein, a strategy for printable, therm...