Bark, H., Lee, P. S., & Engineering, S. o. M. S. a. (2023). Flexible and printable composite ink for thermalmanagement of soft electronics.
Chicago Style CitationBark, Hyunwoo, Pooi See Lee, and School of Materials Science and Engineering. Flexible and Printable Composite Ink for Thermalmanagement of Soft Electronics. 2023.
MLA CitationBark, Hyunwoo, Pooi See Lee, and School of Materials Science and Engineering. Flexible and Printable Composite Ink for Thermalmanagement of Soft Electronics. 2023.
Warning: These citations may not always be 100% accurate.