Nickel interlayer on the microstructure and property of TC6 to copper alloy diffusion bonding

• المؤلفون الرئيسيون: Gao, Linfeng, Li, Xianfen, Hua, Peng, Wang, Meng, Zhou, Wei
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2020
• الموضوعات: Engineering::Mechanical engineering; Diffusion Bonding; TC6
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/142150

In the present study, diffusion bonding of two dissimilar materials TC6 and copper alloy was investigated in vacuum chamber by directly bonding and using Ni foil as interlayer. Interface quality of the joints was evaluated by mechanical property and microstructure. The maximum shear strength of dire...