Gao, L., Li, X., Hua, P., Wang, M., Zhou, W., & Engineering, S. o. M. a. A. (2020). Nickel interlayer on the microstructure and property of TC6 to copper alloy diffusion bonding.
Chicago Style CitationGao, Linfeng, Xianfen Li, Peng Hua, Meng Wang, Wei Zhou, and School of Mechanical and Aerospace Engineering. Nickel Interlayer On the Microstructure and Property of TC6 to Copper Alloy Diffusion Bonding. 2020.
MLA CitationGao, Linfeng, et al. Nickel Interlayer On the Microstructure and Property of TC6 to Copper Alloy Diffusion Bonding. 2020.
Warning: These citations may not always be 100% accurate.