Improving ultrasonic embossing process of copper nanowire

One-dimensional metallic nanostructures have been of great interest as their properties could be customized for specific applications through a variety of nanoimprinting methods. As most metallic nanowire arrays fabrication methods are limited by long fabrication time and high costs, ultrasonic nano...

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書目詳細資料
主要作者: Gui, Keith Zhi Peng
其他作者: Hong Li
格式: Final Year Project
語言:English
出版: Nanyang Technological University 2020
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在線閱讀:https://hdl.handle.net/10356/141396
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