Improving ultrasonic embossing process of copper nanowire

• المؤلف الرئيسي: Gui, Keith Zhi Peng
• مؤلفون آخرون: Hong Li
• التنسيق: Final Year Project
• اللغة: English
• منشور في: Nanyang Technological University 2020
• الموضوعات: Engineering::Mechanical engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/141396
• المؤسسة: Nanyang Technological University

One-dimensional metallic nanostructures have been of great interest as their properties could be customized for specific applications through a variety of nanoimprinting methods. As most metallic nanowire arrays fabrication methods are limited by long fabrication time and high costs, ultrasonic nano...