APA引文

Gui, K. Z. P., & Li, H. (2020). Improving ultrasonic embossing process of copper nanowire. Nanyang Technological University.

Chicago Style Citation

Gui, Keith Zhi Peng, and Hong Li. Improving Ultrasonic Embossing Process of Copper Nanowire. Nanyang Technological University, 2020.

MLA引文

Gui, Keith Zhi Peng, and Hong Li. Improving Ultrasonic Embossing Process of Copper Nanowire. Nanyang Technological University, 2020.

警告：這些引文格式不一定是100％准確.