High frequency characterization of 100 micron pitch wafer level package interconnects

由 Jayabalan, J., Rotaru, M.D.
出版 2014

Novel circuit model for three-dimensional geometries with multilayer dielectrics

由 Jayabalan, J., Ooi, B.-L., Leong, M.-S., Iyer, M.K.
出版 2014

Modelling and application of elastomer mesh for microwave probing

由 Jayabalan, J., Ooi, B.-L., Leong, M.S., Iyer, M.K.
出版 2014

Circuit model of elastomer probe for fine pitch wafer level package test applications

由 Jayabalan, J., Ooi, B.L., Leong, M.S., Iyer, M.K.
出版 2014

Energetics of copper nanowires

由 Jayabalan, J., Jayaganthan, R., Tay, A.A.O., Leong, O.B.
出版 2014

A scaling technique for partial element equivalent circuit analysis using SPICE

由 Jayabalan, J., Leong, O.B., Seng, L.M., Iyer, M.K.
出版 2014

PEEC model for multiconductor systems including dielectric mesh

由 Jayabalan, J., Ooi, B.L., Irene, A., Leong, M.S., Iyer, M.K.
出版 2014

A methodology for accurate modeling of a pad structure from S-parameter measurements

由 Jayabalan, J., Ooi, B.L., Wu, B., Xu, D.S., Iyer, M.K., Leong, M.S.
出版 2014

Test bench modeling and characterization for fine pitch wafer level packaged devices

由 Jayabalan, J., Mihai, R.D., Tan, J.P.H., Iyer, M.K., Leong, O.B., Seng, L.M.
出版 2014

A novel test strategy for fine pitch wafer-level packaged devices

由 Jayabalan, J., Rotaru, M.D., Rao, V.S., Kripesh, V., Iyer, M.K., Tay, A.A.O., Ooi, B.-L., Leong, M.-S.
出版 2014