Numerical Analysis of Microring Resonator obtained by Wafer-Bonding Technology

بواسطة Kusko, M, Alexandropoulos, D, TEE, Chyng Wen, Kapsalis, A, Cristea, D, Syvridis, D
منشور في 2005

Vertically Coupled Microring Laser Devices based on InP using BCB Wafer Bonding

بواسطة Hamacher, M., Heidrich, H., Troppenz, U., Syvridis, D., Alexandropoulos, D., Mikroulis, S., Kapsalis, A., TEE, Chyng Wen, Williams, K. A., Dragoi, V., Alexe, M., Cristea, D., Kusko, M.
منشور في 2007

Wafer-Bonded Active/Passive Vertically Coupled Microring Lasers

بواسطة Hamacher, M., Heidrich, H., Troppenz, U., Syvridis, D., Alexandropoulos, D., Mikroulis, S., Kapsalis, A., TEE, Chyng Wen, Williams, K. A., Dragoi, V., Alexe, M., Cristea, D., Kusko, M.
منشور في 2008