Message from the Chairs: TechDebt 2023

• المؤلفون الرئيسيون: TREUDE, Christoph, CAI, Yuanfang, XIA, Xin, CODABUX, Zadia, HATA, Hideaki, DEISSENBOECK, Florian, SPINOLA, Rodrigo
• التنسيق: text
• اللغة: English
• منشور في: Institutional Knowledge at Singapore Management University 2023
• الموضوعات: Software Engineering
• الوصول للمادة أونلاين: https://ink.library.smu.edu.sg/sis_research/8954; https://ink.library.smu.edu.sg/context/sis_research/article/9957/viewcontent/td.pdf
• المؤسسة: Singapore Management University

Welcome to the 6th ACM/IEEE International Conference on Technical Debt, TechDebt 2023, co-located with the International Conference on Software Engineering (ICSE) 2023, in the beautiful city of Melbourne, Australia. After several years of virtual and hybrid conferences, TechDebt 2023 marks the first...