Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications

Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications

10.1016/j.msea.2006.01.088

Saved in:

書目詳細資料
Main Authors:	Kumar, K.M., Kripesh, V., Shen, L., Zeng, K., Tay, A.A.O.
其他作者:	MECHANICAL ENGINEERING
格式:	Article
出版:	2014
主題:	Growth morphology Intermetallic compounds Nanoindentation technique Sn-8Zn-3Bi alloys
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/85453
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

相似書籍

Nanoindentation study of the Pb-free solders in fine pitch interconnects
由: Mohankumar, K., et al.
出版: (2014)

Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
由: Alam, M.E., et al.
出版: (2014)

Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications
由: SIVA SURI CHANDRA RAO BHESETTI
出版: (2013)

A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu
由: Yan, L.-L., et al.
出版: (2014)

FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY
由: LIN YITENG
出版: (2015)

Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
由: Chandra Rao, B.S.S., et al.
出版: (2014)

Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization
由: Yu, D.-Q., et al.
出版: (2014)

Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications
由: Kumar, K.M., et al.
出版: (2014)

Nanoindentation study of nanocrystalline nickel
由: Jayaganthan, R., et al.
出版: (2014)

Fractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couples
由: Jayaganthan, R., et al.
出版: (2014)

Nano-particle reinforced solders for fine pitch applications
由: Mohankumar, K., et al.
出版: (2014)

Correlation between intermetallic thickness and roughness during solder reflow
由: Zuruzi, A.S., et al.
出版: (2014)

Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders
由: Kumar, K.M., et al.
出版: (2014)

Nanoindentation on polymer materials
由: YANG SHUANG
出版: (2010)

Measurement of the hardness of ultra-thin films by the first derivative of load-displacement curve from nanoindentation data
由: Kumar, A., et al.
出版: (2014)

Nanoindentation and morphological studies on nylon 66/organoclay nanocomposites. II. Effect of strain rate
由: Shen, L., et al.
出版: (2014)

Zn2SnO4 nanowires versus nanoplates: Electrochemical performance and morphological evolution during Li-cycling
由: Cherian, C.T., et al.
出版: (2014)

Evaluation of hardness of the interfacial reaction products at the alumina-stainless steel brazed interface by modeling of nanoindentation results
由: Kar, A., et al.
出版: (2014)

Nanoindentation study of polymer based nanocomposites
由: Nai, M.H., et al.
出版: (2014)

Understanding structural variations in elastic organic crystals by in situ high-pressure Fourier transform infrared spectroscopy and nanoindentation study
由: Ganguly, Somnath, et al.
出版: (2021)

Synthesis of nanostructured titanium based intermetallics by mechanical alloying
由: ZHANG FAN
出版: (2010)

Elastic-plastic deformation of Pb(Zn1/3Nb2/3)O 3-(6-7)% PbTiO3 single crystals during nanoindentation
由: Wong, M.F., et al.
出版: (2014)

In situ operando investigations of the thermal instability mechanisms of a deformed Ti-48Al alloy
由: Krishnan, P.S. Sankara Rama, et al.
出版: (2025)

Nanoindentation study of human premolars subjected to bleaching agent
由: Hairul Nizam, B.R., et al.
出版: (2014)

Characterization of the mechanical properties of visco-elastic and visco-elastic-plastic materials by nanoindentation tests
由: ZHANG CHUNYU
出版: (2010)

Structural changes and thermal stability of mechanically alloyed Ti-Al powders with additions of Mn and Nb
由: Lu, L., et al.
出版: (2014)

Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
由: Mohan Kumar, K., et al.
出版: (2014)

Nanoindentation hardness and modulus of Al2O3–SiO2–CaO and MnO–SiO2–FeO inclusions in iron
由: Slagter, Alejandra, et al.
出版: (2024)

Alternative methods to extract the hardness and elastic modulus of thin films from nanoindentation load-displacement data
由: Kumar, A., et al.
出版: (2014)

Experimental determination of micromachined discrete and continuous device spring constants using nanoindentation method
由: Chan, M.L., et al.
出版: (2014)

Experimental determination of micromachined discrete and continuous device spring constants using nanoindentation method
由: Chan, M.L., et al.
出版: (2014)

The superior properties of spark plasma sintered La-Fe-Si magnetocaloric alloys
由: Wu, Yu-Cai, et al.
出版: (2023)

Effect of Temperature on Cu2ZnSnS4 Nanomaterial Synthesized by Hydrothermal Approach
由: Pham, Thi Hong, et al.
出版: (2018)

Deformation behavior of PZN-6%PT single crystal during nanoindentation
由: Wong, M.F., et al.
出版: (2014)

Effect of liquid-liquid transition on solidification and wettability of Sn-0.7Cu-xBi solder
由: Li, X. F., et al.
出版: (2021)

Advanced nanoindentation simulations for carbon nanotube reinforced nanocomposites
由: Ahmed, K.S., et al.
出版: (2021)

IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING
由: ARUN KUMAR SESURAJ
出版: (2017)

A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages
由: ZHAO BING
出版: (2010)

Thermomechanical properties of Zeta (Ag₃In) phase
由: Liu, Xunda, et al.
出版: (2024)

Nanoindentation study of the irrigants treated human premolar
由: HAIRUL NIZAM BIN RAMLI
出版: (2011)