Novel numerical and experimental analysis of dynamic responses under board level drop test

• المؤلفون الرئيسيون: Tee, T.Y., Luan, J.-E., Pek, E., Lim, C.T., Zhong, Z.
• مؤلفون آخرون: MECHANICAL ENGINEERING
• التنسيق: Conference or Workshop Item
• منشور في: 2014
• الوصول للمادة أونلاين: http://scholarbank.nus.edu.sg/handle/10635/73689
• المؤسسة: National University of Singapore

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004