APA引文

Kumar, A., Jayaganthan, R., Chandra, R., Chawla, V., Tay, A., & ENGINEERING, M. (2014). Nanoindentation study of sputtered Al-Cu thin films for interconnect applications.

Chicago Style Citation

Kumar, A., R. Jayaganthan, R. Chandra, V. Chawla, A.A.O Tay, and MECHANICAL ENGINEERING. Nanoindentation Study of Sputtered Al-Cu Thin Films for Interconnect Applications. 2014.

MLA引文

Kumar, A., et al. Nanoindentation Study of Sputtered Al-Cu Thin Films for Interconnect Applications. 2014.