Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
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| التنسيق: | Conference or Workshop Item |
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2014
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| الوصول للمادة أونلاين: | http://scholarbank.nus.edu.sg/handle/10635/73482 |
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sg-nus-scholar.10635-734822024-11-13T13:23:07Z Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications Jayaganthan, R. Mohankumar, K. Tay, A.A.O. Kripesh, V. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 620-624 2014-06-19T05:35:38Z 2014-06-19T05:35:38Z 2004 Conference Paper Jayaganthan, R.,Mohankumar, K.,Tay, A.A.O.,Kripesh, V. (2004). Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 620-624. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73482 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Jayaganthan, R. Mohankumar, K. Tay, A.A.O. Kripesh, V. |
| format |
Conference or Workshop Item |
| author |
Jayaganthan, R. Mohankumar, K. Tay, A.A.O. Kripesh, V. |
| spellingShingle |
Jayaganthan, R. Mohankumar, K. Tay, A.A.O. Kripesh, V. Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications |
| author_sort |
Jayaganthan, R. |
| title |
Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications |
| title_short |
Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications |
| title_full |
Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications |
| title_fullStr |
Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications |
| title_full_unstemmed |
Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications |
| title_sort |
fractal analysis of sn-ag, sn-ag-cu, sn-ag-bi interfacial morphology in flipchip packaging applications |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73482 |
| _version_ |
1821225459409485824 |