Analytical solutions for interconnect stress in board level drop impact

• Main Authors: Wong, E.H., Mai, Y.-W., Seah, S.K.W., Lim, K.-M., Lim, T.B.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Article
• 出版: 2014
• 主題: Analytical solutions; Drop impact; Electronic packaging; Electronics packaging; Integrated circuit manufacture; Mechanical shocks; Stress analysis
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/59537

10.1109/TADVP.2007.898599