Effect of processing parameters on electroless Cu seed layer properties

• المؤلفون الرئيسيون: Chen, Z., Chan, L., See, Alex K. H., Law, S. B., Zeng, K. Y., Shen, L., Tee, K. C., Ee, Elden Yong Chiang
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94035; http://hdl.handle.net/10220/8212

Electroless Cu seed layer is essential for subsequent copper metallization by electroplating for sub-micron wafer technology. This layer is required to provide good step coverage and high uniformity. In the current work, electroless copper was deposited on a TiN surface activated by palladium. The e...