Design and development of diamond wire sawing setup
With fixed abrasive wire sawing technology becoming a new trend in silicon wafering processes as well as other industries that require slicing technology, the study of its efficiency becomes increasingly important. The objective of this project is to design and develop a diamond wire sawing setup th...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2012
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| Online Access: | http://hdl.handle.net/10356/49948 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | With fixed abrasive wire sawing technology becoming a new trend in silicon wafering processes as well as other industries that require slicing technology, the study of its efficiency becomes increasingly important. The objective of this project is to design and develop a diamond wire sawing setup that is able to assist in the study of the performance of such wafering technique.
The prototype developed would be an integral part of the Mikrotools Integrated Multi-process Machine Tool DT110. The prototype design make use of Mikrotools DT110 as the fundamental operating platform and some of the machining tools and attachments are used as components for the design. The prototype 2 developed for this project is capable of achieving a linear wire speed of approximately 2.4 m/s and accommodating a workpiece of 3 inches in width and 1 inch in height.
Finally, Scanning Electron Microscope analysis is carried out to evaluate the cuts and scratches made by the prototype in order to determine its performance. The analysis is then utilized to allow fine tuning and refinement to be made to the design. |
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