Report on effects of adding metal additives to aluminum oxide
Aluminum oxide has been widely used in the electronics industry as a packaging and insulating material. For electronic packaging of harsh environment, which is in high temperature and extreme high atmospheric pressure, materials with high hardness, high fracture toughness and low thermal conductivit...
Saved in:
主要作者: | Chang, Jun Hua. |
---|---|
其他作者: | Gan Chee Lip |
格式: | Final Year Project |
語言: | English |
出版: |
2012
|
主題: | |
在線閱讀: | http://hdl.handle.net/10356/49536 |
標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
機構: | Nanyang Technological University |
語言: | English |
相似書籍
-
Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
由: Yang, Ying, et al.
出版: (2014) -
Investigation of nano-copper for electronic packaging application : solder metallization and die attach
由: Luo, Kaiming
出版: (2016) -
Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability
由: Yang, Ying, et al.
出版: (2014) -
Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation
由: Yang, Ying, et al.
出版: (2014) -
Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters
由: Lim, Adeline B. Y., et al.
出版: (2014)