Soldering alloys : composition, microstructure and joint characteristics

• المؤلف الرئيسي: Ang, Edwin Hui Jun
• مؤلفون آخرون: Chen Zhong
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2010
• الموضوعات: DRNTU::Engineering::Materials::Metallic materials::Alloys
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/35666

Microstructure and mechanical properties of two new solder materials were investigated. Its elemental composition before and after cooling was also studied. New solder material was proposed to be able to join ceramics such as aluminium or titanium oxide without much intensive sample preparation. T...