Wafer level silicon mould fabrication and imprinting of high density microstructures

• المؤلفون الرئيسيون: Wong, T. I., Ong, H. Y., Lu, H. J., Tse, M. S., Quan, C. G., Ng, S. H., Zhou, X.
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/101184; http://hdl.handle.net/10220/16751

Wafer level mould fabrication and its imprinting technology are of great interest for cost effective mass fabrication of nano or microsized patterns. Although the process for making a silicon mould involves only several steps such as photolithography, deep reactive ion etching (DRIE) and nanoimprint...