ผลของอันตรกิริยาระหว่างคลอไรด์กับสารเติมแต่งชนิดอื่นต่อการพอกพูนทองเเดงด้วยไฟฟ้า

• Main Author: ณัทกฤช กิจพิทักษ์
• Other Authors: นิสิต ตัณฑวิเชฐ
• Format: Theses and Dissertations
• Language: Thai
• Published: จุฬาลงกรณ์มหาวิทยาลัย 2011
• Subjects: การชุบเคลือบผิวด้วยไฟฟ้า; การชุบทองแดง; ปฏิกิริยาออกซิเดชัน-รีดักชัน; Electroplating; Copper plating; Oxidation-reduction reaction
• Online Access: https://digiverse.chula.ac.th/Info/item/dc:34639
• Institution: Chulalongkorn University

This study investigated the effect of additives such as Chloride (Cl), thiourea (TU), benzotriazole (BTA), polyethylene glycol (PEG) and 3-mercapto-1-propanesulfonate sodium salt (MPS) and their interactions with Cl ion on copper electrodeposition. Cyclic voltammetry (CV) results indicated that the presence of Cl alone accelerated the electrodeposition process, whereas the presence of TU or BTA alone inhibited it with dose dependence. The presence of PEG alone did not change the CV much at low concentrations (< 300 µM), but at high concentrations the electrodeposition of Cu were found inhibited. The presence of MPS was found accelerating the electrodeposition process at low potentials, but inhibiting it at higher potentials. When Cl was present with other additives, Cl interacted with each additive differently. TU + Cl and PEG + Cl inhibited electrodeposition process, whereas BTA + Cl and MPS + Cl accelerated it. Overall, the copper deposits prepared by DC plating indicated that TU, TU + Cl- and BTA improved the deposit properties, where small grained structures and bright surfaces were obtained. On the other hand Cl-, BTA + Cl- and MPS + Cl- worsened the deposit properties, while PEG did not show substantial change from the copper deposit obtained in the plating solution without additive. The qualities of deposits prepared from MPS alone, however, were found depending on the charge density where small and fine grains with smooth deposits were obtained at low charge densities, but coarse structures and rough deposits were produced at high charge densities. Overall, except the TU system, the additions of Cl with other additives were found worsening the deposit structures, but in different ways, the presences of TU and Cl tended to improve the deposit microscopically, but might lead to macroscopically rough deposit surface.