Improving adhesion of copper thin films of alumina substrate through interface engineering

بواسطة Lim, Ju Dy
منشور في 2016

Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate

بواسطة Lim, Ju Dy, Lee, Pui Mun, Chen, Zhong
منشور في 2017

Surface roughness effect on copper–alumina adhesion

بواسطة Lim, Ju Dy, Yeow, Su Yi Susan, Rhee, MinWoo Daniel, Leong, Kam Chew, Wong, Chee Cheong
منشور في 2016