Improving adhesion of copper thin films of alumina substrate through interface engineering

by Lim, Ju Dy
Published 2016

Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate

by Lim, Ju Dy, Lee, Pui Mun, Chen, Zhong
Published 2017

Surface roughness effect on copper–alumina adhesion

by Lim, Ju Dy, Yeow, Su Yi Susan, Rhee, MinWoo Daniel, Leong, Kam Chew, Wong, Chee Cheong
Published 2016