Hidden Markov Models for abnormal event processing in transportation data streams

بواسطة Lau, J.K.-S., Tham, C.-K.
منشور في 2014

The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding

بواسطة Yu, D., Lee, C., Lau, J.H.
منشور في 2014

Participatory cyber physical system in public transport application

بواسطة Lau, J.K.S., Tham, C.-K., Luo, T.
منشور في 2014

Critical factors for successful implementation of enterprise systems

بواسطة NAH, Fiona Fui-hoon, LAU, J., KUANG, J.
منشور في 2001

The health belief model and colorectal cancer screening in the general population: A systematic review

بواسطة Lau, J., Lim, T.-Z., Jianlin Wong, G., Tan, K.-K.
منشور في 2021

Investigation of transmission of Au films with nanohole arrays created by nanosphere lithography

بواسطة Wang, B., Gao, H., Lau, J.Y., Chua, S.J.
منشور في 2014

Harnessing chemoselective imine ligation for tethering bioactive molecules to platinum(iv) prodrugs

بواسطة Wong, D.Y.Q., Lau, J.Y., Ang, W.H.
منشور في 2014

Enhanced replication of porcine circovirus type 2 (PCV2) in a homogeneous subpopulation of PK15 cell line

بواسطة Zhu, Y., Lau, A., Lau, J., Jia, Q., Karuppannan, A.K., Kwang, J.
منشور في 2011

Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging

بواسطة Lee, C., Yu, D., Yu, A., Yan, L., Wang, H., Lau, J.H.
منشور في 2014

Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

بواسطة Yu, D.-Q., Lee, C., Yan, L.L., Thew, M.L., Lau, J.H.
منشور في 2014

Concise, efficient and practical assembly of bromo-5,6-dimethoxyindole building blocks

بواسطة Huleatt, P.B., Lau, J., Chua, S., Tan, Y.L., Duong, H.A., Chai, C.L.L.
منشور في 2014

Design and modeling of nanophotonic beam structures as optical NEMS sensors

بواسطة Lee, C., Thillaigovindan, J., Yu, A., Radhakrishnan, R., Chen, C.-C., Chao, Y.-T., Lau, J.H.
منشور في 2014

The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization

بواسطة Yu, D.-Q., Lee, C., Yan, L.L., Choi, W.K., Yu, A., Lau, J.H.
منشور في 2014

Development of wafer level packaged scanning micromirrors

بواسطة Yu, A., Lee, C., Yan, L.L., Zhang, Q.X., Yoon, S.U., Lau, J.H.
منشور في 2014

Psychometric validation of the PROQOL-HIV questionnaire, a new health-related quality of life instrument-specific to HIV disease

بواسطة Duracinsky M., Lalanne C., Coeur S., Herrmann S., Berzins B., Armstrong A., Fai Lau J., Fournier I., Chassany O.
منشور في 2017

Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging

بواسطة Lee, C., Yu, A., Yan, L., Wang, H., He, J.H., Zhang, Q.X., Lau, J.H.
منشور في 2014

A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint

بواسطة Yan, L., Lee, C., Yu, D., Choi, W.K., Yu, A., Yoon, S.U., Lau, J.H.
منشور في 2014

Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization

بواسطة Yu, D.-Q., Yan, L.L., Lee, C., Choi, W.K., Thew, S., Foo, C.K., Lau, J.H.
منشور في 2014

Attenuation of porcine circovirus 2 in SPF piglets by abrogation of ORF3 function

بواسطة Karuppannan, A.K., Zhu, Y., Selvaraj, M., Lau, J., Jia, Q., Kwang, J., Jong, M.H., Lee, S.-H.
منشور في 2011

Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization

بواسطة Yu, D., Yan, L., Lee, C., Choi, W.K., Thew, M.L., Foo, C.K., Lau, J.H.
منشور في 2014