Board level drop test reliability of IC packages

by Chai, T.C., Quek, S., Hnin, W.Y., Wong, E.H., Chia, J., Wang, Y.Y., Tan, Y.M., Lim, C.T.
Published 2014

Design of a bidirectional WDM module for multi-channel transceivers

by Zhang, J., Lim, T.G., Li, J., Ramana, P.V., Ramkumar, V.M., John, L.H.-S., Hnin, W.Y., Kwong, D.L.
Published 2016

Super stretched solder interconnects for wafer level packaging

by Rajoo, R., Wong, E.H., Lim, S.S., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
Published 2014

Development of stretch solder interconnections for wafer level packaging

by Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
Published 2014